ɛlɛtrɔnik mfiri a wɔatintim .

ɛlɛtrɔnik mfiri a wɔatintim .

 

Precision Plasma Surface Treatment ma ɛlɛtrɔnik mfiri a wɔatintim & mfiri a ɛyɛ mmerɛw .

advanced plasma surface treatment ma wotumi de adhesion enhancement a wotumi de ho to so ma wɔ substrates a ɛyɛ mmerɛw a wɔde di dwuma wɔ:

  • Nsɛm a wɔatintim a ɛyɛ mmerɛw (FPCs)- a ɛma polyimide (PI) ne PET sini ahorow yɛ adwuma ma conductive ink bonding .
  • OLED/LCD a ɛda adi - pre{1}}Mfaso a wɔde sa ultra-Ahwehwɛ a ɛyɛ mmerɛw (UTFG) ne ITO a wɔde kata so
  • Thin{0}}Film batere - LI-ion electrode foils no ani yɛ adwuma .

 

Ko tia

Plasma ano aduru .

Mfiridwuma mu mfaso .

Polymers a ɛwɔ soro a ɛba fam .

Oxygen/argon/plasma de hydroxyl ({0}}OH) & carboxyl ({1}}COOH) ba .

Nkitahodi anim a wɔtew so fi 80℃→30℃wɔ .<1s

Nneɛma a wɔde gu mu-Nneɛma a ɛyɛ mmerɛw .

Pulsed DBD plasma wɔ .<50°C prevents thermal damage

Nanoscale nsakrae ( .<10nm depth) only

Adhesion huammɔdi wɔ UTFG so .

DCSBD plasma yi hydrocarbons bere a ɛde oxygen dwumadi ahorow ka ho .

105× resistivity so tew wɔ RGO circuits mu .

 

 
 
Nneɛma a wɔde yɛ adwuma{0}}Potoro ahorow pɔtee .
  • Polyimide sini ahorow (Kapton®) .

Ɔkwan a wɔfa so yɛ: N2/h2 Plasma wɔ 20kHz, 7KV .

Nea efi mu ba: 60% a ɛkɔ soro wɔ ink adhesion vs. corona ayaresa mu .

 

  • Ultra-Ahwehwɛ a ɛyɛ mmerɛw (UTFG) .

Adeyɛ: diffuse coplanar surface barrier discharge (DCSBD) .

Nea efi mu ba: 40% conductivity nkɔanim wɔ PEDOT:PSS coatings .

 

  • li{0}}ion electrode foils .

Adeyɛ: wim plasma a ɛwɔ HE/O2 mix .

Nea efi mu ba: 15% peel ahoɔden a ɛkorɔn wɔ laminated nkwammoaa mu .

 

  • Engineer-Ano aduru a wɔasiesie ama nsu a wɔde gu mu-Nneɛma a ɛho hia .

Yɛn nhyehyɛe ahorow no ka bom ankasa-bere mu impedance monitoring ne adaptive power control a wɔde besiw arcing ano:

Ɔhyew-No bio-polymers (sɛ nhwɛso no, PLGA scaffolds) .

Micro-a wɔayɛ no sɛnea ɛte no .

Batere a wɔde paapae batere mu a ɛwɔ abon mu .

 

  • Di yɛn Surface Engineering kuw no ho nkɔmmɔ ma:

▶︎ Nneɛma a ɛne ne ho hyia ho sɔhwɛ amanneɛbɔ (a WCA/SEM/XPS data ka ho) .

▶︎ Process validation ne wo substrates (PI/COP/PEN) .

▶︎ wɔ-Site parameter optimization so de siw discharge damage ano .